IRGC75B120KB www.irf.com 2/14/2000 die in wafer form mechanical data electrical characteristics (wafer form) die outline nominal backmetal composition, (thickness) al - ti - ni/v - ag, (1ka - 1ka - 4ka - 6ka) nominal front metal composition, (thickness) 99% al/1% si, (4m) dimensions 0.443" x 0.443" wafer diameter 150mm, with std. < 100 > flat wafer thickness, tolerance 185m, +/-15m relevant die mechanical dwg. number 01-5316 minimum street width 100m reject ink dot size 0.25mm diameter minimum ink dot location consistent throughout same wafer lot recommended storage environment store in original container, in dessicated nitrogen, with no contamination recommended die attach conditions for optimum electrical results, die attach temperature should not exceed 300c parameter description guaranteed (min, max) test conditions v ce (on) collector-to-emitter saturation voltage 1.18v min, 1.35v max i c = 10a, t j = 25c, v ge = 15v v (br)ces colletor-to-emitter breakdown voltage 1200v min t j = 25c, i ces = 750a, v ge = 0v v ge(th) gate threshold voltage 4.4v min, 6.0v max v ge = v ce , t j =25c, i c = 750a i ces zero gate voltage collector current 30a max t j = 25c, v ce = 1200v i ges gate-to-emitter leakage current 2 a max t j = 25c, v ge = +/-20v e c g 1200v i c(nom) = 75a v ce(on) typ. = 2.1 v @ i c(nom) @ 25c motor control igbt short circuit rated 150mm wafer features features features features features ? gen5 non punch through (npt) technology ? low v ce(on) ? 10 s short circuit capability ? square rbsoa ? positive v ce(on) temperature coefficient benefits ? benchmark efficiency for motor control applications ? rugged transient performance ? excellent current sharing in parallel operation 9.773 [.385] 1.99 [.078] emitter > [.050] t olerance = + /- [.008] > 1.270 t oler ance = + /- 0.203 < [.050] t olerance = + /- [.004] < 1.270 t oler ance = + /- 0.102 > [.0250] t olerance = + /- [.0010] > 0.635 t oler ance = + /- 0.025 < [.0250] t olerance = + /- [.0005] < 0.635 t oler ance = + /- 0.013 1.32 [.052] length g wi dt h & overall die: length & wi dt h bonding pads: 9.854 [.388] e = emitter not es : 1. all dimens ions are s hown in mil l ime t e rs [inche s ]. 4. dime ns ional t ol e rance s : 3. le t t e r de s ignat ion: 2. cont rolling dimens ion: [inch]. sk = source kelvin is = current sense g = gat e s = source 11.25 [.443] 01-5316 pd - 93872
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